Cooling solution for a dock

ABSTRACT

The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.

FIELD

The present techniques generally relate to the cooling of computingand/or electronic devices. More specifically, the present techniquesrelate to a dock with cooling via an integrated Peltier material.

BACKGROUND

As computing devices with small form factors continue to become morepowerful, they have also become thinner and lighter. These powerfulcomputing devices with small form factors may be physically orwirelessly docked to docking units for convenient access to additionalresources, including a network, a printer, mass storage devices such ashard disk drives, compact disks (CD) or digital video disk (DVD) drives,and other types of peripheral devices. By using a docking unit, suchperipheral resources become available once the computing device isdocked. Docking a computing device can also provide power to thecomputing device, such that the battery may be recharged and the devicewould be supplied with power from the mains power supply of a structure,such as a home or office building.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of dock;

FIG. 2A is a perspective front view of a system including a computingdevice docked with a dock;

FIG. 2B is a rear view of a system including a computing device dockedwith a dock;

FIG. 3A is an illustration of a system including a cool air inlet andupper and lower exhaust vents;

FIG. 3B is an illustration of a system including a cool air inlet, upperand lower exhaust vents, and a heat exchanger;

FIG. 4 is an illustration of a system including a dock with a singleexhaust vent;

FIG. 5 is an illustration of a system including a foldable dock;

FIG. 6 is a process flow diagram illustrating a method for a dock with acooling solution; and

FIG. 7 is a block diagram of a system on chip (SoC) on a printed circuitboard (PCB).

In some cases, the same numbers are used throughout the disclosure andthe figures to reference like components and features. Numbers in the100 series refer to features originally found in FIG. 1; numbers in the200 series refer to features originally found in FIG. 2; and so on.

DESCRIPTION OF THE EMBODIMENTS

Docks often enable computing devices to access storage and variousperipheral devices in order to provide the functionality of a larger,generally stationary desktop computing device. As used herein, acomputing device generally refers to devices such as tablets, phablets,notepads, laptops, mobile devices, mobile phones, smart phones, and thelike. Computing devices typically include rechargeable batteries thatcan be charged while coupled with the dock. An electrical outlet mayenable access to the mains power supply of a structure, such as a homeor office building. In embodiments, the dock includes components toconvert alternating current (A/C) power from the electrical outlet todirect current (D/C) power. The D/C power is then routed to thecomputing device through a wireless connector or through a physicalpower supply cable.

Embodiments described herein provide a dock with cooling via anintegrated thermoelectric material. In embodiments, the dock can performtypical docking features, such as enabling access to various peripheraldevices, cooling, and charging. The dock may include an integratedPeltier ceramic plate to cool a docked computing device. In embodiments,the dock also includes alignment mechanisms, such as a magneticattachment component. Further, the dock may include an air mover toguide air through the dock. Through the present techniques, a closedloop power, temperature, and condensation control of a computing devicemay be enabled by a cooling dock. This closed loop power, temperature,and condensation control enables the dock to maximize performance of thecomputing device according to ambient conditions and performance demandsof the device.

Reference is now made to the drawings, wherein like reference numeralsare used to refer to like elements throughout. In the followingdescription, for purposes of explanation, numerous specific details areset forth in order to provide a thorough understanding thereof. It maybe evident, however, that the novel embodiments can be practiced withoutthese specific details. In other instances, well known structures anddevices are shown in block diagram form in order to facilitate adescription thereof. The intention is to cover all modifications,equivalents, and alternatives within the scope of the claims.

FIG. 1 is a block diagram of dock 100. In embodiments, a computingdevice, such as a tablet or phablet may be docked with the dock 100.Although the present techniques are described using a phone device, anycomputing device capable of being docked can be used. Additionally, thedock, as used herein, can refer to any device that is to expand adevice's access to peripheral devices, and/or supply power to thecomputing device.

The dock 100 includes a thermoelectric cooling area 102. Inthermoelectric cooling, a heat flux may be created between the junctionof two conducting materials. Heat may be transferred from one locationto another, across the junction, based on the direction of the current.The dock may include a plurality of junctions, wherein the coolingoccurs at each junction based on the flow of current. Each junction isin series with the remaining junctions. In embodiments, thethermoelectric cooling is accomplished using the Peltier effect, and isreferred to as using a Peltier plate. The materials selected of thePeltier plate can include any materials with Peltier coefficients thatcan create a cooling effect.

The thermoelectric device 102 is located along a thermally conductivefront material 104. In embodiments, the thermoelectric device 102 islocated underneath or behind the thermally conductive front material 104and is thermally coupled with the thermally conductive front material104. The thermally conductive front material 104 creates a front planeand a docked computing device may dock parallel to the front planecreated by the thermally conductive front material 104. The dock 100 mayinclude an exhaust 106A and an exhaust 1068. The exhaust 106A and theexhaust 1068 are to enable the flow of air within the dock 100. In thismanner, heated air can be moved away from components of the dock by anair mover, such as a fan. While the exhaust 106A and the exhaust 1068are illustrated at the top and bottom of the dock 100, the exhaust 106Aand the exhaust 1068 can be located at any point on the dock 100.Moreover, a single exhaust or vent or a plurality of exhausts or ventsmay be located on the dock 100.

The dock 100 also includes an alignment mechanism 108. In embodiments,the alignment mechanism is located behind the thermally conductive frontplane 104. The alignment mechanism may be, for example magnetic strips.The computing device may have corresponding magnetic strips that guidethe computing device into position when a user physically couples thecomputing device with the dock 100. Magnetic strips, when used as analignment mechanism, enables close physical contact between the deviceand the dock in order to minimize thermal contact resistance. Anyalignment mechanism is to enable close physical contact between thedevice and the dock, and can be placed according to the particulardesign of the dock. Thus, the alignment mechanism can be located placedto the side of the front plane, above the front plane, below the frontplane, and so on.

The dock may supply electricity to a computing device via a power supplycable. The dock 100 can also include components to convert the A/C powerto D/C power for use by the computing device. For example, the dock 100can include a transformer to convert the voltage from the A/C powersupply of a building to a lower voltage, a rectifier to convert it topulsating waveform, and a filter to smooth the pulsating waveform toD/C. D/C power can be delivered from the dock 100 to a computing device.

The dock may also implement wireless charging. In wireless charging,resonant inductive coupling between circuitry of the dock and the deviceresults in an electrical energy that is transmitted between the dock andthe device. Specifically, two magnetically coupled coils are each a partof resonant circuits of the dock and the device are tuned to resonate atthe same frequency. A transmitter coil in the dock can transmits acharging radiation across an intervening space to a resonant receivercoil in the device. In this manner, devices can be charged without aphysical coupling to an electrical outlet. Additional wireless chargingoptions include, but are not limited to Contact/Open Dots and Pogo Pins.

Accordingly, the present techniques enable both wireless charging andwireless data transfer solutions. Additionally, the computing device maybe positioned at multiple angles with multiple modes of viewing withoutremoving the computing device from the cooling surface. For example, thedevice may be placed on the cooling dock in any of a portrait mode, alandscape mode, and all angles in between.

FIG. 2A is a perspective front view of a system 200A including acomputing device docked with a dock. As illustrated, a computing device202 is docked with the dock 204. The system 200 also illustrates aPeltier plate 206 of the dock 204 with dotted lines. The Peltier plate206 is illustrated for reference purposes and may not be visible fromoutside of the dock. The computing device 202 is secured in place via analignment mechanism, such as magnetic strips.

The computing device 202 may include materials and circuitry at thelocation of the Peltier plate 206 so that the computing device can coolefficiently via the Peltier plate 206. Additionally, the computingdevice 202 may include corresponding alignment mechanisms so that thecomputing device may properly align with the dock 204.

By properly aligning the computing device 202 and the dock 204, a regionof the dock is in physical contact with a region on the surface of thedevice. Through this contact, a junction between two conductingmaterials is created, and heat is transferred from one location toanother, across the junction, based on the direction of the current. Inthis manner, heat may be transferred from the device to the dock,thereby cooling the device. Note that the device includes theappropriate circuitry to enable cooling when in contact with thethermoelectric cooling region of the dock.

FIG. 2B is a rear view of a system 200A including a computing devicedocked with a dock. As illustrated, a computing device 202 is dockedwith the dock 204. An air intake 208 may enable components of the dock204 to move air from outside of the dock, through the interior of thedocket, and out an exhaust 210. In this manner, an air mover within thedock 204 can cool the thermoelectric device as it generates heat.

The dock may also include a plurality of ports 212. The ports 212 may beused to communicatively couple peripheral devices with the computingdevice 202. In embodiments, a port 212 is a Universal Serial Bus (USB)Type-C plug or connector. The USB Type-C plug and connector are definedaccording to the USB Type-C Specification 1.0, released Aug. 11, 2014.The USB Type-C connector is a USB connector that is smaller thanprevious USB connectors and that enables a connection with a USBreceptacle at any orientation. In some cases, the USB Type-C connectoris a primary charging connector of a USB device. In embodiments, thedock enables support of the USB Power Delivery Specification, Revision2.0, released Aug. 11, 2014. Additionally, the dock may enable supportof charging according to the USB Battery Charging Specification 1.2,released Dec. 7, 2010. Although a USB Type-C connector is describedherein, any type of I/O connector can be used. Thus, the presenttechniques also enable wired charging and data communications via acable and according to Universal Serial Bus (USB) standards.Additionally, wireless data communication, may be accomplished viatechniques including, but not limited to Pogo Pin and lens data transfer(Lambda).

In embodiments, the dock may be a “smart” dock and can transmit andreceive additional power information to the computing device. Theadditional power information may be a power profile, a charging profile,temperatures, and the like. The additional power information may beobtained by the dock via a sensor, sensor hub, microcontroller, and thelike. In embodiments, physical connector may enable power andcommunication between the computing device and the dock while thecomputing device is docked. Alternatively, the dock may provide powerwirelessly to the computing device via inductive charging or similartechnology while docked, and communication via Bluetooth or similarwireless communication technologies. Bluetooth communication may referto communication according to any Bluetooth specification, such asBluetooth version 4.2, released Dec. 2, 2014.

FIG. 3A is an illustration of a system 300A including a cool air inletand upper and lower exhaust vents. The dock 302 includes a Peltier plate304 along a front face 306 of the dock 302. The positioning of thePeltier plate 304 is along the front face of the dock 302 is for ease ofdescription only. The Peltier plate 304 may be placed at any positionthat enables physical contact with a docked device. The dock 302 alsoincludes an upper exhaust vent 308A and a lower exhaust vent 308B. Anintake air vent 310 may guide cool air from outside of the dock 302 towithin the dock 302 as illustrated by the arrow 312. In embodiments, anair mover 314 is used to move air through the dock 302. Heated air fromwithin the dock 302 may be expelled through the upper exhaust vent 308Aand the lower exhaust vent 308B as illustrated by the arrow 316.

In embodiments, the dock 302 may include one or more air movers 314 tocreate a flow of air to cool components of the dock 302. In embodiments,the air mover is a fan or blower. Additionally, in embodiments, the airmover is an electrokinetic system. The air mover may cause an airflowfrom the exterior of the dock 302, through the dock 302 as illustratedby arrow 312, and out of the dock 302 as illustrated by the arrow 316.In embodiments, the heat air flows through both the upper exhaust vent308A and the lower exhaust vent 308B. As use of the a docked computingdevice becomes computationally complex and requires use of severalprocessing components of the computing device, heating of the computingdevice may also increase as a direct result of additional processing.For example, when the computing device is used in high performanceapplications, the processing done by the computing device may causeadditional heat to be generated. Through the present techniques, coolingof the computing device is enhanced via thermoelectric cooling, therebyenabling high performance of the computing device since additional heatis removed by the airflow from the dock combined with the thermoelectricdevice. Although the thermoelectric device can enhance cooling, the dockis capable of enabling performance enhancements of a computing deviceeven when the thermoelectric device is not powered, and not in use. Inparticular, the dock may provide further cooling via the air mover andheat sink as described below. The airflow through the dock may be amulti-speed airflow, such that when the thermoelectric device generatesa large amount of heat, the airflow is higher in order to provide morecooling for the thermoelectric device. The multi-speed airflow mayprovide a lower speed of airflow when the thermoelectric device generatea lesser amount of heat.

For example, a computing device may be coupled with the dock and usedfor typical, everyday activities such as word processing, web browsing,and the like. Typical activities include those activities that are notcomputationally intensive, do not require a large amount of processingtime, and thus do not generate large amounts of thermal energy. Inresponse to the typical activities, the multi-speed airflow may be low.Additionally, the computing device may be coupled with the dock and usedfor other activities such as gaming, video conferencing, and the like.Other activities, as used herein, include those activities which arecomputationally intensive and can require a large amount of processingtime, a large amount of processing cores, or other processing thatgenerates a large amount of thermal energy. In response to the otheractivities, the multi-speed airflow may be high.

Accordingly, the speed of the airflow may change from low to and high tolow as the heat generated by the computing device changes and requiresdiffering amounts of cooling. As illustrated by the previous example,the heat generated by the computing device may change according to theuse of the computing device and the corresponding use of the processingunit(s). The thermoelectric device of the dock may be in physicalcontact with the computing device in order to cool the computing device,while an air mover is able to provide a multi-speed airflow to cool thethermoelectric device as needed. In embodiments, the speed of themulti-speed airflow is based on the thermal energy generated by thethermoelectric device as it cools the computing device. In this manner,airflow through the dock and ultimately the cooling of a dockedcomputing device may be scaled according to the use of the dockedcomputing device.

Additionally, in embodiments, the speed of the multi-speed airflow isbased on a temperature measurement received from the computing device.For example, the temperature measurement may be a temperature of aprocessing unit of the computing device or the temperature may be atemperature measurement at or near the portion of the computing devicethat is in physical contact with the thermoelectric device. Moreover,the speed of the multi-speed airflow may be based on a temperaturemeasurement within the dock. The air speed may also be adjusted tocontrol any condensation detected within the computing device or thedock.

In embodiments, a second air mover may also be configured to cool thecomputing device components as necessary. In some embodiments, the dockand a docked computing device are cooled by an airflow produced by thesame air mover in additional to thermoelectric cooling as describedabove. In embodiments, a docked computing device is cooled according toa use profile, such that the airflow and thermoelectric cooling are afunction of use profile for the computing device. Additionally, inembodiments, the airflow may be a multi-speed airflow. Moreover,condensation within the computing device may be controlled by increasethe cooling of the computing device, thereby controlling the temperatureof the device and ultimately condensation within the device.

FIG. 3B is an illustration of a system including a cool air inlet, upperand lower exhaust vents, and a heat exchanger 330. Similar to FIG. 3A,the dock 302 includes a Peltier plate 304 at a front face 306 of thedock 302. The dock 302 also includes an upper exhaust vent 308A and alower exhaust vent 308B. An intake air vent 310 may guide cool air fromoutside of the dock 302 to within the dock 302 as illustrated by thearrow 312. In embodiments, an air mover 314 is used to move air throughthe dock 302. A heat exchanger 330 may also be used to draw heat awayfrom the Peltier plate 304. The air mover 314 may directed air throughthe dock 302, across both the Peltier plate 304 and the heat exchanger330, and away from the dock via through the upper exhaust vent 308A andthe lower exhaust vent 308B as illustrated by the arrow 316. In additionto the use of a fan to cool the thermoelectric device, a heat sink maybe thermally coupled with the thermoelectric device for coolingpurposes. While a heat exchanger is described, any heat exchanger may beused, such as a heat sink or heat pipe. The heat exchanger may includevarious plate fin heat exchangers arranged throughout the dock. Inembodiments, the fins of the heat exchanger may be used to route airthrough the interior of the dock. Additionally, the dock may providecooling through the use of one or more of any of the air mover,thermoelectric device, or heat exchangers. For example, the dock canenable cooling and performance enhancements even when the Peltier is notpowered. In this manner, the dock can dynamically implement a coolingsolution via one or more of any of the air mover, thermoelectric device,or heat exchangers.

FIG. 4 is an illustration of a system 400 including a dock with a singleexhaust vent. The system 400 includes a dock 402. In embodiments, thephablet 406 is physically coupled with the dock 402 via an alignmentmechanism, such as a plurality of magnetic strips. In embodiments, thedock 402 includes a plurality of ports that are to couple a plurality ofperipheral devices with the phablet 406 coupled with the dock 402.

In embodiments, the dock 402 enables several connection types. Inembodiments, the dock 402 may include ports according to variousstandards, such as USB Type-C, USB2, USB3, PCIe, HDMI, DisplayPort, andso on. The USB Type-C standard can be used to enable connection typessuch as the USB2, USB3, PCIe, HDMI, DisplayPort, and the like. Inembodiments, data transfer across the USB Type-C connector is accordingto any standard supported by the USB Type-C Specification. The USB2 isaccording to the Universal Serial Bus 2.0 Specification released April2000. The USB3 is according to the Universal Serial Bus 3.1Specification released on July, 2013. A High-Definition MultimediaInterface (HDMI) connection may be according to the HDMI SpecificationVer. 2.0 released September 2013. DisplayPort (DP) may be according tothe DisplayPort 1.3 released September 2014.

The dock 402 may include an intake air vent 408. In embodiments, an airmover will intake air through the intake air vent 408 to cool componentsof the dock 402. Heated air from within the dock 402 may be expelled viaan exhaust vent 410 as illustrated by an arrow 412. Although aparticular airflow is illustrated, the airflow through the adapter canbe arranged in a number of configurations. In embodiments, channelswithin the dock are to guide the airflow through the dock. Additionally,channels located near the front plane of the dock can guide air from anairflow around the front side and back side of a computing device whenphysically docked. While the airflow is described as flowing across thefront/back surfaces of the computing device, in embodiments a vent oropening on the computing device enables an airflow through the tablet.

The dock as described herein enables a cooling solution that can bescaled to enable dynamic cooling of the dock, in direct response to thecooling needs of a docked device. In this manner, the performance of adocked device can be increased several multiples higher than thenatural, average capability of a mobile system. Put another way, theperformance of a docked device is not limited by overheating concerns asis a device without additional cooling available. Further, the dock candynamically communicates with the computing device. In embodiments, thedynamic communication enables the scaling of cooling requirements at thedock as necessary. A temperature control feedback loop may be used toscale the cooling requirements of the dock. Moreover, the power used bythe computing device may also be scaled according to the coolingabilities of the dock, resulting in optimized power scaling.

FIG. 5 is an illustration of a system 500 including a foldable dock. Adock 502 is illustrated and is coupled to a computing device 504. Thecomputing device 504 may be cooled by a thermoelectric device, and maybe coupled with the dock 502 via a magnetic strip for alignment.Additionally, air intake vents and exhaust vents may be positioned atvarious locations along the dock 502. In some cases, folding the dockmay block or otherwise interfere with the air flow through air intakevents. As a result, the dock may include multiple air intake vents, suchthat air flow through the dock is not compromised when the dock in afolded position. The dock 502 may include an air mover to force cool airfrom outside of the dock 502, through the dock 502, and can expel theheated air from the dock 502.

In embodiments, the dock 502 is a travel, portable dock that can befolded at various positions. For example, the dock 502 may be folded ata position 506A or a second position 506B. Although two foldablepositions are illustrated, the dock 502 may be foldable at any position.

In embodiments, airflow would be tuned within the dock via channels,baffles, and other appropriate air restrictors within the dock. Inembodiments, when a computing device is docked, additional cooling isavailable from the dock. The additional cooling enables processing unitsof the computing device to increase performance, including but notlimited to an increase in a processing core's clock upper speeds. Thisenables the computing device to be more adept when processing heavyworkloads, such as gaming, streaming videos, or any other workload thatcauses a high amount of processing activity. Such a cooling scheme maybe referred to as Adaptive Performance. Moreover, docking the enables anunlimited supply of power rather than the device running off of a finitesupply of battery power. The access to unlimited power enables higherpower modes that might not be available while running solely off ofpower from a battery.

Additionally, in embodiments, the physical or wireless docking enablesthe computing device to be communicatively coupled with another devicevia the dock. The dock may include a microcontroller that is toimplement cooling according to an Adaptive Performance scheme. Via thephysical or wireless docking, a user can further connect the computingdevice and/or or the dock to specific endpoints like USB devices, audioheadsets, or DisplayPort displays. In embodiments, the computing devicemay be used to control the air mover via a physical or wirelessconnection. The computing device can control the volume of air and thespeed of air output by the air mover. The air mover may be enumerated bythe computing device as a USB device that is discovered after docking.In this manner, the tablet can monitor the state of power management ofits system elements with the additional cooling functionality from thedock.

FIG. 6 is a process flow diagram illustrating a method 600 for a dockwith a cooling solution. At block 602, a dock is configured to receive athermoelectric cooling plate. In embodiments, an air mover is configuredto move air surrounding components of the dock, including thethermoelectric cooling components, across the components and out of thedock. At block 604, the dock is configured to receive a computingdevice. In embodiments, the computing device may be aligned with thedock via an alignment mechanism. In embodiments, the alignment mechanismmay be magnetic strips. In response to the computing device beingdocked, the dock can cool the computing device thermoelectrically.

FIG. 7 is a block diagram of a system on chip (SoC) 700 on a printedcircuit board (PCB) 702. The SoC 700 and PCB 702 may be components of,for example, a computing device such as a laptop computer, Ultrabook,tablet computer, computing device, or phablet, among others. Thecomputing device may be coupled with a dock as described herein. The SoC700 may include a central processing unit (CPU) 704 that is configuredto execute stored instructions, as well as a memory device 706 thatstores instructions that are executable by the CPU 704. The CPU may becoupled to the memory device 706 by a bus 708. Additionally, the CPU 704can be a single core processor, a multi-core processor, a computingcluster, or any number of other configurations. Furthermore, the SoC 700may include more than one CPU 704.

The SoC 700 may also include a graphics processing unit (GPU) 710. Asshown, the CPU 704 may be coupled through the bus 708 to the GPU 710.The GPU 710 may be configured to perform any number of graphicsfunctions and actions. For example, the GPU 710 may be configured torender or manipulate graphics images, graphics frames, videos, or thelike, to be displayed to a user of the SoC 700. The memory device 706can include random access memory (RAM), read only memory (ROM), flashmemory, or any other suitable memory systems. For example, the memorydevice 706 may include dynamic random access memory (DRAM).

The CPU 704 may be connected through the bus 708 to an input/output(I/O) device interface 712 configured to connect the SoC 700 throughvarious layers of the PCB 702, and components of the PCB 702 to one ormore I/O devices 714. The I/O devices 714 may include, for example, akeyboard and a pointing device, wherein the pointing device may includea touchpad or a touchscreen, among others. The I/O devices 714 may bebuilt-in components of a platform including the SoC 700, or may bedevices that are externally connected to a platform including the SoC700. In embodiments, the I/O devices 714 are coupled with a computingdevice including the SOC 700 via a dock.

The CPU 704 may also be linked through the bus 708 to a displayinterface 716 configured to connect the SoC 700 through various layersof the PCB 702, and components of the PCB 702 to one or more displaydevices 718. The display device(s) 718 may include a display screen thatis a built-in component of a platform including the SoC 700. Examples ofsuch a computing device include mobile computing devices, such as cellphones, tablets, 2-in-1 computers, notebook computers or the like. Thedisplay device 718 may also include a computer monitor, television, orprojector, among others, that is externally connected to the SoC 700. Inembodiments, the display devices 718 are coupled with a computing deviceincluding the SOC 700 via a dock.

The USB package 720 may include a transmitter and a receiver in order totransmit and receive USB data. The USB package 720 may also includecomponents necessary to implement the USB Battery ChargingSpecification, USB On-the-Go Specification, and the USB Power DeliverySpecification, and the USB Type-C Specification. The PCB 702 may alsoinclude components to implement the various USB Specifications. Datafrom the USB package 720 may be sent to a multiplexer (MUX) 722 and onto a plurality of USB devices 724. The MUX 722 may be used to selectbetween various USB features enabled by the USB package 720. Forexample, the MUX 722 may be used to implement USB 2.0, USB 3.0, USBBattery Charging, USB Power Delivery, HDMI, DisplayPort, or PCIe, amongothers. In embodiments, the USB devices 714 are coupled with a computingdevice including the SOC 700 via a dock.

The SoC 700 may also be coupled with a storage device 726. The storagedevice may be a component located on the PCB 702. Additionally, thestorage device 726 can be a physical memory such as a hard drive, anoptical drive, a thumb drive, an array of drives, or any combinationsthereof. The storage device 726 may also include remote storage drives.The SoC 700 may also include a network interface controller (NIC) 728may be configured to connect the SoC 700 through the bus 708, variouslayers of the PCB 702, and components of the PCB 702 to a network 730.The network 730 may be a wide area network (WAN), local area network(LAN), or the Internet, among others.

It is to be understood that the block diagram of FIG. 7 is not intendedto indicate that the SoC 700 is to include all of the components shownin FIG. 7. Rather, the SoC 700 can include fewer or additionalcomponents not illustrated in FIG. 7. Furthermore, the components may becoupled to one another according to any suitable system architecture,including the system architecture shown in FIG. 7 or any other suitablesystem architecture that uses a data bus to facilitate communicationsbetween components. For example, embodiments of the present techniquescan also be implemented any suitable computing or computing device,including ultra-compact form factor devices, such as SoC and multi-chipmodules.

Example 1 is a dock for a computing device. The computing deviceincludes a thermoelectric device; an alignment mechanism; and an airmover, wherein the alignment mechanism is to align the computing devicewhen docking the computing device, and the thermoelectric device is tocool the computing device when docked, and the air mover is to enable anairflow through the dock to cool the thermoelectric device when thecomputing device is docked.

Example 2 includes the computing device of example 1, including orexcluding optional features. In this example, the thermoelectric deviceis a Peltier ceramic plate.

Example 3 includes the computing device of any one of examples 1 to 2,including or excluding optional features. In this example, the alignmentmechanism includes at least one magnetic strip.

Example 4 includes the computing device of any one of examples 1 to 3,including or excluding optional features. In this example, the dockcomprises at least partially hardware logic that is to control thethermoelectric device.

Example 5 includes the computing device of any one of examples 1 to 4,including or excluding optional features. In this example, the airflowthrough the dock is a multi-speed airflow and the speed of the airflowis scaled according to a use of the computing device.

Example 6 includes the computing device of any one of examples 1 to 5,including or excluding optional features. In this example, thethermoelectric device is to cool the computing device via a heat fluxbetween the thermoelectric device and the computing device.

Example 7 includes the computing device of any one of examples 1 to 6,including or excluding optional features. In this example, thethermoelectric device is to cool the computing device through a Peltiereffect between materials of the thermoelectric device and materials ofthe computing device.

Example 8 includes the computing device of any one of examples 1 to 7,including or excluding optional features. In this example, the dockfurther comprises a heat exchanger.

Example 9 includes the computing device of any one of examples 1 to 8,including or excluding optional features. In this example, the computingdevice includes a corresponding alignment mechanism to secure thecomputing device in physical contact with the thermoelectric device.

Example 10 includes the computing device of any one of examples 1 to 9,including or excluding optional features. In this example, the air moveris an electrokinetic system.

Example 11 is a system. The system includes a dock, wherein the dockcomprises: a microcontroller; a thermoelectric device; an alignmentmechanism; and an air mover, wherein the alignment mechanism is to aligna docked computing device, and the microcontroller is to enable thethermoelectric device to cool the docked computing device, and the airmover is to enable an airflow through the dock to cool thethermoelectric device.

Example 12 includes the system of example 11, including or excludingoptional features. In this example, the thermoelectric device is inphysical contact with the docked computing device.

Example 13 includes the system of any one of examples 11 to 12,including or excluding optional features. In this example, the dockcomprises air restrictors to guide the airflow across the computingdevice.

Example 14 includes the system of any one of examples 11 to 13,including or excluding optional features. In this example, the computingdevice comprises a vent and an air restrictor of the dock is configuredto guide airflow through the vent of the computing device.

Example 15 includes the system of any one of examples 11 to 14,including or excluding optional features. In this example, the airflowthrough the dock is to control condensation within the dock.

Example 16 includes the system of any one of examples 11 to 15,including or excluding optional features. In this example, airflowthrough the dock is scaled according to the use of the docked computingdevice.

Example 17 includes the system of any one of examples 11 to 16,including or excluding optional features. In this example, thethermoelectric device is coupled with a thermally conductive material ofthe dock.

Example 18 includes the system of any one of examples 11 to 17,including or excluding optional features. In this example, the alignmentfeature is a plurality of magnetic strips.

Example 19 includes the system of any one of examples 11 to 18,including or excluding optional features. In this example, the dockcomprises at least partially hardware logic that is to control thethermoelectric device and the air mover. Optionally, the computingdevice is communicatively coupled with the logic that is to control thethermoelectric device and the air mover.

Example 20 is a method for configuring a dock. The method includesconfiguring the dock to receive a thermoelectric cooling plate; andconfiguring the dock to receive a computing device.

Example 21 includes the method of example 20, including or excludingoptional features. In this example, the dock comprises an alignmentmechanism to receive the computing device.

Example 22 includes the method of any one of examples 20 to 21,including or excluding optional features. In this example, thethermoelectric cooling plate is a Peltier ceramic cooling plate.

Example 23 includes the method of any one of examples 20 to 22,including or excluding optional features. In this example, thethermoelectric cooling plate is physically coupled with a thermallyconductive material of the dock.

Example 24 includes the method of any one of examples 20 to 23,including or excluding optional features. In this example, an air moverof the dock is to enable a multi-speed airflow and the speed of theairflow is scaled according to a use of the computing device.Optionally, in response to a computationally intensive use of thecomputing device, the multi-speed airflow increases.

Example 25 includes the method of any one of examples 20 to 24,including or excluding optional features. In this example, the methodincludes configuring a heat exchanger within the dock.

Example 26 includes the method of any one of examples 20 to 25,including or excluding optional features. In this example, thethermoelectric cooling plate is to cool the computing device accordingto a use profile of the computing device.

Example 27 includes the method of any one of examples 20 to 26,including or excluding optional features. In this example, the dock isconfigured to physically couple with the computing device to enablethermoelectric cooling of the computing device.

Example 28 includes the method of any one of examples 20 to 27,including or excluding optional features. In this example, the dock isconfigured to physically couple with the computing device in at leastone of a landscape mode and a portrait mode of the computing device.

Example 29 is an apparatus. The apparatus includes a means forelectrically cooling a computing device; an alignment mechanism; and anair mover, wherein the alignment mechanism is to align the computingdevice when docking the computing device, and the means to electricallycool the computing device is to cool the computing device when docked,and the air mover is to enable an airflow through the dock to cool themeans to electrically cool the computing device when the computingdevice is docked.

Example 30 includes the apparatus of example 29, including or excludingoptional features. In this example, the means to electrically cool thecomputing device is a Peltier ceramic plate.

Example 31 includes the apparatus of any one of examples 29 to 30,including or excluding optional features. In this example, the alignmentmechanism includes at least one magnetic strip.

Example 32 includes the apparatus of any one of examples 29 to 31,including or excluding optional features. In this example, the dockcomprises at least partially hardware logic that is to control the meansto electrically cool the computing device.

Example 33 includes the apparatus of any one of examples 29 to 32,including or excluding optional features. In this example, the airflowthrough the dock is a multi-speed airflow and the speed of the airflowis scaled according to a use of the computing device.

Example 34 includes the apparatus of any one of examples 29 to 33,including or excluding optional features. In this example, the means toelectrically cool the computing device is to cool the computing devicevia a heat flux between the means to electrically cool the computingdevice and the computing device.

Example 35 includes the apparatus of any one of examples 29 to 34,including or excluding optional features. In this example, the means toelectrically cool the computing device is to cool the computing devicethrough a Peltier effect between materials of the means to electricallycool the computing device and materials of the computing device.

Example 36 includes the apparatus of any one of examples 29 to 35,including or excluding optional features. In this example, the dockfurther comprises a heat exchanger.

Example 37 includes the apparatus of any one of examples 29 to 36,including or excluding optional features. In this example, the computingdevice includes a corresponding alignment mechanism to secure thecomputing device in physical contact with the means to electrically coolthe computing device.

Example 38 includes the apparatus of any one of examples 29 to 37,including or excluding optional features. In this example, the air moveris an electrokinetic system.

In the foregoing description, numerous specific details have been setforth, such as examples of specific types of system configurations,specific hardware structures, specific architectural and microarchitectural details, specific register configurations, specificinstruction types, specific system components, specificmeasurements/heights, specific processor pipeline stages and operationetc. in order to provide a thorough understanding of the presentinvention. It will be apparent, however, to one skilled in the art thatthese specific details need not be employed to practice the presentinvention. In other instances, well known components or methods, such asspecific and alternative processor architectures, specific logiccircuits/code for described algorithms, specific firmware code, specificinterconnect operation, specific logic configurations, specificmanufacturing techniques and materials, specific compilerimplementations, specific expression of algorithms in code, specificpower down and gating techniques/logic and other specific operationaldetails of computer system haven't been described in detail in order toavoid unnecessarily obscuring the present invention.

In the above description and the following claims, the terms “coupled”and “connected,” along with their derivatives, may be used. It should beunderstood that these terms are not intended as synonyms for each other.Rather, in particular embodiments, “connected” may be used to indicatethat two or more elements are in direct physical or electrical contactwith each other. “Coupled” may mean that two or more elements are indirect physical or electrical contact. However, “coupled” may also meanthat two or more elements are not in direct contact with each other, butyet still co-operate or interact with each other.

Some embodiments may be implemented in one or a combination of hardware,firmware, and software. Some embodiments may also be implemented asinstructions stored on a machine-readable medium, which may be read andexecuted by a computing platform to perform the operations describedherein. A machine-readable medium may include any mechanism for storingor transmitting information in a form readable by a machine, e.g., acomputer. For example, a machine-readable medium may include read onlymemory (ROM); random access memory (RAM); magnetic disk storage media;optical storage media; flash memory devices.

An embodiment is an implementation or example. Reference in the presentspecification to “an embodiment”, “one embodiment”, “some embodiments”,“various embodiments”, or “other embodiments” means that a particularfeature, structure, or characteristic described in connection with theembodiments is included in at least some embodiments, but notnecessarily all embodiments, of the present techniques. The variousappearances of “an embodiment,” “one embodiment,” or “some embodiments”are not necessarily all referring to the same embodiments. Elements oraspects from an embodiment can be combined with elements or aspects ofanother embodiment.

Not all components, features, structures, characteristics, etc.described and illustrated herein need be included in a particularembodiment or embodiments. If the specification states a component,feature, structure, or characteristic “may”, “might”, “can” or “could”be included, for example, that particular component, feature, structure,or characteristic is not required to be included. If the specificationor claim refers to “a” or “an” element, that does not mean there is onlyone of the element. If the specification or claims refer to “anadditional” element, that does not preclude there being more than one ofthe additional element.

It is to be noted that, although some embodiments have been described inreference to particular implementations, other implementations arepossible according to some embodiments. Additionally, the arrangementand/or order of circuit elements or other features illustrated in thedrawings and/or described herein need not be arranged in the particularway illustrated and described. Many other arrangements are possibleaccording to some embodiments.

In each system shown in a figure, the elements in some cases may eachhave a same reference number or a different reference number to suggestthat the elements represented could be different and/or similar.However, an element may be flexible enough to have differentimplementations and work with some or all of the systems shown ordescribed herein. The various elements shown in the figures may be thesame or different. Which one is referred to as a first element and whichis called a second element is arbitrary.

The present techniques are not restricted to the particular detailslisted herein. Indeed, those skilled in the art having the benefit ofthis disclosure will appreciate that many other variations from theforegoing description and drawings may be made within the scope of thepresent techniques. Accordingly, it is the following claims includingany amendments thereto that define the scope of the present techniques.

What is claimed is:
 1. A dock for a computing device, comprising: athermoelectric device; an alignment mechanism; and an air mover, whereinthe alignment mechanism is to align the computing device when dockingthe computing device, and the thermoelectric device is to cool thecomputing device when docked, and the air mover is to enable an airflowthrough the dock to cool the thermoelectric device when the computingdevice is docked.
 2. The dock of claim 1, wherein the thermoelectricdevice is a Peltier ceramic plate.
 3. The dock of claim 1, wherein thealignment mechanism includes at least one magnetic strip.
 4. The dock ofclaim 1, wherein the dock comprises at least partially hardware logicthat is to control the thermoelectric device.
 5. The dock of claim 1,wherein the airflow through the dock is a multi-speed airflow and thespeed of the airflow is scaled according to a use of the computingdevice.
 6. The dock of claim 1, wherein the thermoelectric device is tocool the computing device via a heat flux between the thermoelectricdevice and the computing device.
 7. The dock of claim 1, wherein thethermoelectric device is to cool the computing device through a Peltiereffect between materials of the thermoelectric device and materials ofthe computing device.
 8. The dock of claim 1, wherein the dock furthercomprises a heat exchanger.
 9. The dock of claim 1, wherein thecomputing device includes a corresponding alignment mechanism to securethe computing device in physical contact with the thermoelectric device.10. The dock of claim 1, wherein the air mover is an electrokineticsystem.
 11. A system, comprising: a dock, wherein the dock comprises: amicrocontroller; a thermoelectric device; an alignment mechanism; and anair mover, wherein the alignment mechanism is to align a dockedcomputing device, and the microcontroller is to enable thethermoelectric device to cool the docked computing device, and the airmover is to enable an airflow through the dock to cool thethermoelectric device.
 12. The system of claim 11, wherein thethermoelectric device is in physical contact with the docked computingdevice.
 13. The system of claim 11, wherein the dock comprises airrestrictors to guide the airflow across the computing device.
 14. Thesystem of claim 11, wherein the computing device comprises a vent and anair restrictor of the dock is configured to guide airflow through thevent of the computing device.
 15. The system of claim 11, wherein theairflow through the dock is to control condensation within the dock. 16.The system of claim 11, wherein airflow through the dock is scaledaccording to the use of the docked computing device.
 17. A method forconfiguring a dock, comprising: configuring the dock to receive athermoelectric cooling plate; and configuring the dock to receive acomputing device.
 18. The method of claim 17, wherein the dock comprisesan alignment mechanism to receive the computing device.
 19. The methodof claim 17, wherein the thermoelectric cooling plate is a Peltierceramic cooling plate.
 20. The method of claim 17, wherein thethermoelectric cooling plate is physically coupled with a thermallyconductive material of the dock.
 21. The method of claim 17, wherein anair mover of the dock is to enable a multi-speed airflow and the speedof the airflow is scaled according to a use of the computing device. 22.The method of claim 17, comprising configuring a heat exchanger withinthe dock.
 23. The method of claim 17, wherein the thermoelectric coolingplate is to cool the computing device according to a use profile of thecomputing device.
 24. The method of claim 17, wherein the dock isconfigured to physically couple with the computing device to enablethermoelectric cooling of the computing device.
 25. The method of claim17, wherein the dock is configured to physically couple with thecomputing device in at least one of a landscape mode and a portrait modeof the computing device.